Porous Oxygen-Free Copper Seamless Conductor
Designed specifically for high current density and multi-circuit integrated applications, the conductor contains multiple independent through-holes and is integrally formed using oxygen-free copper seamless cold-drawing technology. It is widely used in new energy electrical systems, high-end busbar trunking, and high-power electrical equipment, achieving lightweight design and efficient heat dissipation while ensuring high current transmission capacity.-
Multi-channel Parallel Transmission: The porous structure supports multi-loop parallel wiring, simplifying system layout and improving transmission efficiency.
Lightweight and High-Strength: Lighter than solid copper rods, with higher structural strength and less prone to deformation.
Efficient Heat Dissipation: The porous design increases the heat dissipation area, preventing overheating during prolonged high-current operation.
Stable Electrical Performance: The oxygen-free copper substrate is oxidation-resistant and corrosion-resistant, ensuring stable and reliable performance over long-term use.